BGA
Science & Engineering abbreviation · Electronics & Electrical
| Stands for | Ball grid array |
|---|---|
| Categories | Science & Engineering |
BGA stands for Ball grid array, an electronics & electrical abbreviation.
Surface-mount chip package with an array of solder balls on its underside instead of leads around the edges, allowing hundreds or thousands of connections in a small area. Processors, memory chips and graphics chips commonly use BGA packages.
Example: The laptop's GPU failure was traced to cracked BGA solder joints under the chip.
Usage notes
Because the joints are hidden beneath the package, inspection requires X-ray imaging, and repair uses specialized rework stations that heat and replace the chip, called reballing. Thermal cycling and lead-free solder fatigue contributed to well-known console failures in the late 2000s.
Related abbreviations
More electronics & electrical abbreviations
- ADC – Analog-to-digital converter
- AFCI – Arc-fault circuit interrupter
- AM – Amplitude modulation
- AMOLED – Active-matrix organic light-emitting diode
- ASIC – Application-specific integrated circuit
- AWG – American wire gauge
- BJT – Bipolar junction transistor
- BLDC – Brushless DC motor
- CMOS – Complementary metal-oxide-semiconductor
- CPLD – Complex programmable logic device
- CT – Current transformer
- DAC – Digital-to-analog converter